By optimizing the photosensitive resin formulation and introducing two-dimensional filler hexagonal boron nitride (h-BN), high-performance h-BN/SiCO ceramic matrix composites were successfully prepared via Digital Light Processing (DLP) 3D printing. This approach significantly improved both thermal conductivity and mechanical strength, providing a new strategy for the additive manufacturing of high-performance ceramic materials and expanding their application prospects in high heat dissipation environments.

1. Research Background & Objectives

Modern microelectronics, power electronics, and aerospace systems generate increasingly high thermal flux densities, requiring structural materials that combine exceptional electrical insulation with superior thermal conductivity. Polymer-derived ceramics (PDCs), specifically silicon oxycarbide (SiCO), offer remarkable thermal stability and oxidation resistance. However, their intrinsic thermal conductivity is relatively low. Introducing two-dimensional hexagonal boron nitride (h-BN) nanosheets as a reinforcing thermal conduction filler provides an ideal solution to establish continuous heat conduction networks without compromising insulation.

2. DLP 3D Printing & Slurry Optimization

In this research, a tailored photopolymerizable ceramic slurry was developed by optimizing the dispersant ratio, photoinitiator concentration, and surface modification of h-BN nanosheets. The rheological behavior was carefully tuned to ensure low shear viscosity, high solid loading, and good stability during the scraping process of DLP printing. Multi-layer components were printed with high geometric precision and cured layer-by-layer under UV irradiation.

3. Debinding and Pyrolysis Post-Processing

The green bodies underwent a multi-stage thermal debinding process in a controlled atmosphere to eliminate organic resins while preventing cracking or warpage. Subsequent high-temperature pyrolysis at elevated temperatures transformed the preceramic polymer into dense, crack-free h-BN/SiCO ceramic matrix composites.

4. Thermal & Mechanical Performance Highlights

  • Enhanced Thermal Conductivity: The oriented arrangement of 2D h-BN nanosheets along the printing plane formed efficient heat dissipation pathways, increasing thermal conductivity significantly compared to neat SiCO ceramics.
  • Superior Mechanical Strength: The interface bonding between h-BN and the SiCO matrix deflected microcracks, resulting in marked improvements in flexural strength and fracture toughness.
  • High Temperature Resistance: Maintained high dielectric strength and chemical stability up to 1000°C.

5. Industrial Applications

This DLP 3D printing technology enables complex structural heat sinks, high-power LED ceramic packaging substrates, insulated heat dissipation housings, and thermal management components for next-generation aerospace and automotive electronic devices.